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IDTechEx Discusses Next-Generation RDL Materials in Advanced Semiconductor Packaging




BOSTON, Aug. 11, 2023 /PRNewswire/ — With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology. In the context of interconnected dies on a package, the system’s performance relies heavily on the signaling that happens within the package. Two key metrics, bandwidth and power efficiency, play a pivotal role in determining the success of these advanced semiconductor packaging solutions. In this article, we will focus on the materials requirement for achieving higher bandwidth, one of the essential factors for improved communication between dies.

Bandwidth is a critical performance metric in advanced semiconductor packaging. It refers to the amount of data that can be transmitted or communicated between the dies on the package. Higher bandwidth allows faster and more efficient communication, enabling devices to process data at incredible speeds. Two primary factors are considered to measure bandwidth: IO/mm and Datarate/IO. IO/mm represents the density of I/O connections available on the die edge, while Datarate/IO refers to the data transfer rate of each I/O terminal measured in bps. By multiplying IO/mm by Datarate/IO, we calculate the bandwidth per millimeter of the die edge, which represents the total data that can be transmitted between dies. In simpler terms, bandwidth density indicates the number of bits transmitted and received between dies per mm (for 2D) or per mm2 (for 3D packaging).

The performance of IO/mm and Datarate/IO heavily relies on the redistribution layer (RDL) within the package. Essential features of the RDL, such as Line/Space (L/S), via, and pad dimensions, play a crucial role in achieving optimal performance and data transmission within the package. The dielectric constant of materials used in the redistribution layer (RDL) directly impacts the datarate/IO. Currently, the finest L/S of RDL can be attained using inorganic dielectrics like SiO2, but the material’s relatively high dielectric constant (Dk=3.9) makes it unsuitable for high-speed communication. Additionally, the process is also challenging and costly. As a result, researchers are actively exploring alternative dielectric materials, particularly organic options, which offer the advantages of lower dielectric constants and reduced costs. When selecting organic dielectric materials, several key parameters must be considered to ensure their suitability for the packaging process. IDTechEx’s “Materials and Processing for Advanced Semiconductor Packaging 2024-2034” report identifies five key parameters crucial for organic dielectrics used in advanced semiconductor packaging.

Dk (Dielectric Constant) and Df (Loss Tangent):

A material’s dielectric constant (Dk) determines its ability to support higher data rates without compromising signal integrity. Materials with low Dk are preferred for advanced semiconductor packaging as they reduce wire capacitance and allow for shorter interconnects between dies. Low-loss characteristics also minimize transmission loss in high-frequency communication devices, further enhancing bandwidth.

Elongation to Failure:

For multi-layer RDL (Redistribution Layer) with a higher copper coverage on each layer, a higher elongation to failure is favorable. This property ensures the material can withstand the stresses and strains associated with the packaging process and device operation without mechanical failure.

CTE (Coefficient of Thermal Expansion):

To ensure package reliability, the dielectric material should have a CTE similar to that of the copper metal layer. However, achieving this is challenging due to the inability to use filler particles that increase the dielectric permittivity of the polymer. SiO2 fillers, commonly used in polymer dielectrics, do not aid in reducing the Dk value as they need to be loaded in high volume. Additionally, the presence of fillers hinders the scaling of microvias, which are essential for advanced packaging technologies.

Young’s Modulus:

For a reliable microvia design with a diameter of less than 5 µm, utilizing a polymer material with a low Young’s modulus is crucial. A low modulus helps minimize the stress exerted on the copper, leading to enhanced overall package reliability.

Moisture Absorption:

Moisture absorption of the polymer material is crucial for long-term system reliability. High moisture absorption can lead to delamination and negatively impact both mechanical and electrical performance.

In conclusion, as technology continues to advance, the demand for even higher bandwidth and power efficiency in advanced semiconductor packaging will persist. Organic dielectrics have garnered significant interest due to their potential in offering low dielectric constant (Dk) characteristics, enhanced defect tolerance, and cost-effectiveness. However, it is crucial to acknowledge that selecting the appropriate material always involves trade-offs. For instance, while low dielectric constant polymers offer advantages, they may come with a higher coefficient of thermal expansion (CTE), which can adversely affect device reliability and packaging architectures. Therefore, it becomes imperative to carefully consider and adhere to the five key features and their requirements to ensure the successful development of advanced semiconductor packaging solutions.

IDTechEx’s “Materials and Processing for Advanced Semiconductor Packaging 2024-2034” report offers a structured approach to understanding advanced semiconductor packaging. The report is divided into four main parts. The first part provides a comprehensive introduction to technologies, development trends, key applications, and the ecosystem of advanced semiconductor packaging. The second part focuses on 2.5D packaging processes, including dielectric materials, RDL fabrication techniques, and material selection for EMC and MUF. The third part delves into the innovative Cu-Cu hybrid bonding technology for 3D die stacking, offering insights into the manufacturing process and material selection. The report also includes a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, providing valuable perspectives on market growth and trends for the coming decade.

To find out more about this IDTechEx report, including downloadable sample pages, please visit

IDTechEx’s market research is differentiated through the primary information gathered, technical depth, and unbiased appraisals. IDTechEx covers a wide range of topics and helps understand the industry’s pain points and unmet needs. For more information, please visit

About IDTechEx

IDTechEx guides your strategic business decisions through its Research, Subscription and Consultancy products, helping you profit from emerging technologies. For more information, contact [email protected] or visit

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Lucy Rogers
Sales and Marketing Administrator
[email protected] +44(0)1223 812300 

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Blockchain Press Releases

Flash News: OKX Introduces Exclusive ‘Babylon Pioneer Pass Event’ in Collaboration with Babylon, Offering Free Pioneer Pass NFT Minting for the First 100,000 Users Who Stake on Babylon Testnet




SINGAPORE, March 2, 2024 /PRNewswire/ — OKX, a leading Web3 technology company, has issued updates for March 2, 2024.

OKX Introduces Exclusive ‘Babylon Pioneer Pass Event’ in Collaboration with Babylon, Offering Free Pioneer Pass NFT Minting for the First 100,000 Users Who Stake on Babylon Testnet

OKX today announced the launch of its ‘Babylon Pioneer Pass Event,’ giving users who access the Babylon Testnet and stake any amount of Signet Bitcoin (sBTC) the opportunity to claim Babylon’s Bitcoin Pioneer Pass NFT. To qualify for a spot, users must access the Babylon Testnet and stake any amount of Signet Bitcoin (sBTC).

The event kicks off on February 28 and continues until March 6. Following the event, starting from March 7, participants who have been whitelisted will have the ability to mint their Bitcoin Pioneer Pass NFT using the OKX Wallet and their whitelisted address.

The process of participating in this event is straightforward and involves the following steps:

  1. Firstly, users will need to prepare by setting up their OKX and Keplr Wallets. These wallets will be crucial for interacting with the Babylon Testnet and the subsequent claiming of sBTC and BBN.
  2. Following the wallet setup, users can then claim the sBTC and BBN on Babylon’s Official Discord. These tokens will be needed for staking in the Babylon Testnet.
  3. Finally, users will need to access Babylon’s official website, where users can actively engage, stake their tokens and claim their whitelist spots.

Participation in the event offers a multitude of benefits. Users can engage actively with the Babylon Testnet, which in turn enhances their understanding of the Babylon protocol and its functionalities. Furthermore, participants contribute to the development and evolution of the Babylon protocol by being active users.

The ‘Babylon Pioneer Pass Event‘ is a result of OKX’s partnership with Babylon, a trustless Bitcoin staking protocol. The Bitcoin Pioneer Pass, Babylon’s first commemorative Non-Fungible Token (NFT), is a highlight of this event, representing a significant milestone for both OKX and Babylon.

For more information, please visit the OKX Support Center.

About OKX

A leading global technology company driving the future of Web3, OKX provides a comprehensive suite of products to meet the needs of beginners and experts alike, including:

  • OKX Wallet: The world’s most powerful, secure and versatile crypto wallet which gives users access to over 80 blockchains while allowing them to take custody of their own funds. The wallet includes MPC technology which allows users to easily recover access to their wallet independently, removing the need for traditional, ‘written down’ seed phrases. In addition, OKX Wallet’s account abstraction-powered Smart Account enables users to pay for transactions on multiple blockchains using USDC or USDT, and interact with multiple contracts via a single transaction.
  • DEX: A multi-chain, cross-chain decentralized exchange aggregator of 300+ other DEXs and approximately 15 bridges, with 200,000+ coins and more than 20 blockchains supported.
  • NFT Marketplace: A multi-chain, zero-fee NFT marketplace that gives users access to NFT listings across seven top-tier marketplaces including OpenSea, MagicEden, LooksRare and Blur.
  • Web3 DeFi: A powerful DeFi platform that supports earning and staking on about 70 protocols across more than 10 chains.

OKX partners with a number of the world’s top brands and athletes, including English Premier League champions Manchester City F.C., McLaren Formula 1, The Tribeca Festival, Olympian Scotty James, and F1 driver Daniel Ricciardo.

As a leader building innovative technology products, OKX believes in challenging the status quo. The company recently launched a global brand campaign entitled, The System Needs a Rewrite, which advocates for a new paradigm led by Web3 self-managed technology.

To learn more about OKX, download our app or visit:


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Blockchain Press Releases

Bitget Wallet now supports the Blast Mainnet, pioneering full ecosystem support as a Web3 wallet




VICTORIA, Seychelles, March 1, 2024 /PRNewswire/ — The globally leading Web3 trading wallet Bitget Wallet has now integrated support for the Blast Mainnet, making it the first all-in-one Web3 wallet for the Blast ecosystem. Users can effortlessly add and switch mainnets within the wallet with just one click, without the need for manual configuration. This integration enables users to manage, transfer, swap, and interact on one of the largest L2 launches in 2024.

Bitget Wallet has aggregated liquidity from mainstream DEXs within the Blast ecosystem, such as BlasterSwap and MonoSwap, into its Swap feature. This allows for mainnet token Swap transactions, providing users with convenient services for trading assets on the Blast blockchain.

During the Blast testnet phase, Bitget Wallet was among the first to offer support, unveiled a dedicated zone in its DApp page for Blast. This section featured over 40 elite projects from Blast’s Big Bang incentive program, enabling users to easily explore, interact, and potentially receive future airdrops in the Blast ecosystem. Following the launch of the Blast mainnet, Bitget Wallet plans to continue integrating popular projects from the Blast ecosystem, offering users extensive asset management features and a comprehensive ecosystem experience.

Bitget Wallet’s COO, Alvin Kan, highlights Blast as a Layer 2 solution with staking at its core, gaining market attention since launch. He says, “We’re committed to cutting-edge tech, lowering Web3 engagement barriers. Collaborating with quality mainnets like Blast, we aim to drive Web3 ecosystem growth.”

This week, Bitget Wallet engages with popular Blast ecosystem projects, exploring market traction, “Stake Layer 2” narrative, TVL enhancement strategies by staking and earning points, notable projects, and effective ways for users to participate in the Blast ecosystem upon mainnet launch. This provides users with valuable insights for meaningful ecosystem engagement.

Additionally, Bitget Wallet is organizing major events to support the Blast ecosystem, providing users with opportunities for discovering new assets.

About Bitget Wallet

Bitget Wallet stands as Asia’s largest and one of the world’s top non-custodial Web3 wallets, boasting over 19 million users globally. Featuring a comprehensive array of features including asset management, intelligent market data, swap functionality, launchpad, inscribing, DApp browsing, and more, Bitget Wallet promises users an unmatched multi-chain Web3 experience. Currently, Bitget Wallet supports over 100 blockchains, hundreds of EVM-compatible chains, and more than 250,000 cryptocurrencies. By aggregating liquidity across hundreds of leading DEXs and cross-chain bridges, Bitget Wallet is able to facilitate seamless and efficient trades on 40+ blockchains.

For more information, visit: Website | Twitter | Telegram | Discord

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Blockchain Press Releases

Cashback and Crypto: Bybit’s Monthly Bonanza




DUBAI, UAE, March 1, 2024 /PRNewswire/ —Bybit, one of the world’s top three crypto exchanges by volume, now unveils March’s Fiat Cashback Splash for both fresh and seasoned users who make fiat deposits.

This effort celebrates both new and familiar faces within the Bybit fold. The “Fiat Cashback Splash” is part of Bybit’s pledge to be the world’s Crypto Ark, leading the way to the new financial system, and offering straightforward chances for anyone to get involved. Indeed, any crypto users, including newcomers, will be able to walk the crypto path with Bybit as a reliable ally.

“We aim to always offer more to our users, and the Fiat Cashback Splash is our latest move to improve their journey,” said Ben Zhou, Bybit’s co-founder and CEO. “The Fiat Cashback Splash is our way of saying thank you to our community, both old and new, for their trust and support.”

This event spans the first week of every month and any one of Bybit’s 20 million users who bring fiat to the table will see rewards. Newcomers putting down $100 through fiat or a single click buy will get up to $10 back on fees. Those already with Bybit, depositing $500 or more, will see $5 returned.

For the heavy hitters depositing over $5,000, Bybit adds a $30 Buy Crypto Coupon into the mix, widening the horizon for investment.

#Bybit / #TheCryptoArk

About Bybit

Bybit is a top-three cryptocurrency exchange by volume with 20 million users established in 2018. It offers a professional platform where crypto investors and traders can find an ultra-fast matching engine, 24/7 customer service, and multilingual community support. Bybit is a proud partner of Formula One’s reigning Constructors’ and Drivers’ champions: the Oracle Red Bull Racing team.

For more details about Bybit, please visit Bybit Press.
For media inquiries, please contact: [email protected]
For more information, please visit:
For updates, please follow: Bybit’s Communities and Social Media

Discord | Facebook | Instagram | LinkedIn | Reddit | Telegram | TikTok | X | Youtube

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