Blockchain Press Releases
IDTechEx Discusses Next-Generation RDL Materials in Advanced Semiconductor Packaging
BOSTON, Aug. 11, 2023 /PRNewswire/ — With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology. In the context of interconnected dies on a package, the system’s performance relies heavily on the signaling that happens within the package. Two key metrics, bandwidth and power efficiency, play a pivotal role in determining the success of these advanced semiconductor packaging solutions. In this article, we will focus on the materials requirement for achieving higher bandwidth, one of the essential factors for improved communication between dies.
Bandwidth is a critical performance metric in advanced semiconductor packaging. It refers to the amount of data that can be transmitted or communicated between the dies on the package. Higher bandwidth allows faster and more efficient communication, enabling devices to process data at incredible speeds. Two primary factors are considered to measure bandwidth: IO/mm and Datarate/IO. IO/mm represents the density of I/O connections available on the die edge, while Datarate/IO refers to the data transfer rate of each I/O terminal measured in bps. By multiplying IO/mm by Datarate/IO, we calculate the bandwidth per millimeter of the die edge, which represents the total data that can be transmitted between dies. In simpler terms, bandwidth density indicates the number of bits transmitted and received between dies per mm (for 2D) or per mm2 (for 3D packaging).
The performance of IO/mm and Datarate/IO heavily relies on the redistribution layer (RDL) within the package. Essential features of the RDL, such as Line/Space (L/S), via, and pad dimensions, play a crucial role in achieving optimal performance and data transmission within the package. The dielectric constant of materials used in the redistribution layer (RDL) directly impacts the datarate/IO. Currently, the finest L/S of RDL can be attained using inorganic dielectrics like SiO2, but the material’s relatively high dielectric constant (Dk=3.9) makes it unsuitable for high-speed communication. Additionally, the process is also challenging and costly. As a result, researchers are actively exploring alternative dielectric materials, particularly organic options, which offer the advantages of lower dielectric constants and reduced costs. When selecting organic dielectric materials, several key parameters must be considered to ensure their suitability for the packaging process. IDTechEx’s “Materials and Processing for Advanced Semiconductor Packaging 2024-2034” report identifies five key parameters crucial for organic dielectrics used in advanced semiconductor packaging.
Dk (Dielectric Constant) and Df (Loss Tangent):
A material’s dielectric constant (Dk) determines its ability to support higher data rates without compromising signal integrity. Materials with low Dk are preferred for advanced semiconductor packaging as they reduce wire capacitance and allow for shorter interconnects between dies. Low-loss characteristics also minimize transmission loss in high-frequency communication devices, further enhancing bandwidth.
Elongation to Failure:
For multi-layer RDL (Redistribution Layer) with a higher copper coverage on each layer, a higher elongation to failure is favorable. This property ensures the material can withstand the stresses and strains associated with the packaging process and device operation without mechanical failure.
CTE (Coefficient of Thermal Expansion):
To ensure package reliability, the dielectric material should have a CTE similar to that of the copper metal layer. However, achieving this is challenging due to the inability to use filler particles that increase the dielectric permittivity of the polymer. SiO2 fillers, commonly used in polymer dielectrics, do not aid in reducing the Dk value as they need to be loaded in high volume. Additionally, the presence of fillers hinders the scaling of microvias, which are essential for advanced packaging technologies.
Young’s Modulus:
For a reliable microvia design with a diameter of less than 5 µm, utilizing a polymer material with a low Young’s modulus is crucial. A low modulus helps minimize the stress exerted on the copper, leading to enhanced overall package reliability.
Moisture Absorption:
Moisture absorption of the polymer material is crucial for long-term system reliability. High moisture absorption can lead to delamination and negatively impact both mechanical and electrical performance.
In conclusion, as technology continues to advance, the demand for even higher bandwidth and power efficiency in advanced semiconductor packaging will persist. Organic dielectrics have garnered significant interest due to their potential in offering low dielectric constant (Dk) characteristics, enhanced defect tolerance, and cost-effectiveness. However, it is crucial to acknowledge that selecting the appropriate material always involves trade-offs. For instance, while low dielectric constant polymers offer advantages, they may come with a higher coefficient of thermal expansion (CTE), which can adversely affect device reliability and packaging architectures. Therefore, it becomes imperative to carefully consider and adhere to the five key features and their requirements to ensure the successful development of advanced semiconductor packaging solutions.
IDTechEx’s “Materials and Processing for Advanced Semiconductor Packaging 2024-2034” report offers a structured approach to understanding advanced semiconductor packaging. The report is divided into four main parts. The first part provides a comprehensive introduction to technologies, development trends, key applications, and the ecosystem of advanced semiconductor packaging. The second part focuses on 2.5D packaging processes, including dielectric materials, RDL fabrication techniques, and material selection for EMC and MUF. The third part delves into the innovative Cu-Cu hybrid bonding technology for 3D die stacking, offering insights into the manufacturing process and material selection. The report also includes a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, providing valuable perspectives on market growth and trends for the coming decade.
To find out more about this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/MatsforASP.
IDTechEx’s market research is differentiated through the primary information gathered, technical depth, and unbiased appraisals. IDTechEx covers a wide range of topics and helps understand the industry’s pain points and unmet needs. For more information, please visit www.IDTechEx.com/research.
About IDTechEx
IDTechEx guides your strategic business decisions through its Research, Subscription and Consultancy products, helping you profit from emerging technologies. For more information, contact [email protected] or visit www.IDTechEx.com.
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Media Contact:
Lucy Rogers
Sales and Marketing Administrator
[email protected] +44(0)1223 812300
Social Media Links:
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LinkedIn: www.linkedin.com/company/IDTechEx
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DUBAI, UAE, March 12, 2025 /PRNewswire/ — Bybit, the world’s second-largest cryptocurrency, celebrates financial innovation with the Bybit USDT Festival in a series of events catering to diverse users. From Bybit Card holders to trading pros, Bybit users and community members are sharing over 1.5 million USDT in prizes through various rewards programs.
Festival Highlights
- USDT Derivatives Trading Challenge
Half a million USDT await qualified traders in USDT options and futures at the 500K USDT Derivatives Trading Challenge from now to Mar. 31, 2025. Participants will receive USDT bonuses based on their contributions to the total trading volume, regardless of profit and loss percentage. This inclusive structure allows both individual and institutional traders to earn additional rewards from the 500K USDT prize pool alongside their trading profits.
- Spending Smart with the Bybit Card
As part of the USDT Festival, the Bybit Card will activate a limited-time offer for eligible new users. In addition to the 10% cashback exclusive offer for newcomers, successful new applicants will also gain an instant 10 USDT cashback by simply signing up and spending at least 200 USDT or its equivalent. Between Mar. 10 and Mar. 31, 2025, users can maximize their rewards by setting USDT as the default cashback option for future transactions.
- Bybit Learn: Read-to-Earn USDT Festival Special
Bybit users will be able to take advantage of Bybit Learn’s Read-to-Earn program and enroll in USDT-themed courses for Bybit Earn and Bybit P2P for extra rewards. Starting this March, Bybit Learn will set aside an additional 20,000 USDT for eligible participants.
- Social and Community Giveaway
Bybit fans on official social media and Telegram channels are in for surprises in mini interactive giveaways with 40,000 USDT in prizes throughout March.
- All-Things USDT at Bybit: USDT Festival Livestream
To find out all about the USDT-related benefits and programs at Bybit this spring, users may watch the replay of the USDT Festival livestream featuring speakers from Bybit’s product team, wealth management unit, VIP team, and Bybit Card. Designed to empower traders with expert insights and exclusive opportunities, the livestream was a deep dive into advanced USDT trading strategies, market trends, and an overview of the exclusive perks and competition mechanisms of the USDT Festival.
- TradeMasters Grand Prix 2025 Series 1
High-stake traders have concluded the USDT-themed March TradeMasters Grand Prix in its first instalment of 2025, dividing up a 1 million USDT prize pool.
“The USDT Festival represents our commitment to educating and empowering traders in the dynamic cryptocurrency market,” says Joan Han, Sales and Marketing Director at Bybit. “Stablecoins are facilitating financial opportunities for millions of people and businesses around the world, achieving instant finality and unparalleled cost efficiency. USDT’s utility is its strength, and we are supporting our users in seeking opportunities in the stablecoin ecosystem through Bybit’s powerful platform and offerings,” she said.
USDT is a leading stablecoin that has maintained a $1 peg to the US dollar since its launch in 2014. With a market capitalization exceeding $140 billion at the time of writing, USDT is the most widely traded stablecoin and plays a critical role in the cryptocurrency ecosystem. USDT’s deep liquidity makes it a bridge between fiat currencies and digital assets, enabling seamless transactions and trading within the decentralized finance (DeFi) space.
#Bybit / #TheCryptoArk
About Bybit
Bybit is the world’s second-largest cryptocurrency exchange by trading volume, serving a global community of over 60 million users. Founded in 2018, Bybit is redefining openness in the decentralized world by creating a simpler, open and equal ecosystem for everyone. With a strong focus on Web3, Bybit partners strategically with leading blockchain protocols to provide robust infrastructure and drive on-chain innovation. Renowned for its secure custody, diverse marketplaces, intuitive user experience, and advanced blockchain tools, Bybit bridges the gap between TradFi and DeFi, empowering builders, creators, and enthusiasts to unlock the full potential of Web3. Discover the future of decentralized finance at Bybit.com.
For more details about Bybit, please visit Bybit Press
For media inquiries, please contact: [email protected]
For updates, please follow: Bybit’s Communities and Social Media
Discord | Facebook | Instagram | LinkedIn | Reddit | Telegram | TikTok | X | Youtube
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Blockchain Press Releases
AB DAO Accelerates Global Expansion: Now AB Listed on BitMart & HTX AMA to Explore the Future of Web3
SINGAPORE, March 12, 2025 /PRNewswire/ — AB DAO announced today that $AB has been officially listed on BitMart (bitmart.com). Next, $AB will soon be listed on Lbank (lbank.com) and Biconomy (biconomy.com), further enhancing global liquidity and ecosystem influence.
At the same time, AB DAO has been invited to participate in HTX AMA, discussing AB public chain technology innovation, Real-World Asset (RWA) integration, and Web3 ecosystem development prospects.
BitMart $AB Trading Details
Trading Pair: AB/USDT
Deposit Opening: March 12, 2025, 17:00 (UTC+8)
Trading Opening: March 13, 2025, 17:00 (UTC+8)
Withdrawal Opening: March 14, 2025, 17:00 (UTC+8)
BitMart Official Announcement:
https://bitmart.zendesk.com/hc/en-us/articles/34819457308187
HTX AMA: AB Public Chain and the Future of Community Governance
As part of its global expansion, AB DAO has been invited to join the HTX AMA to explore key topics such as Layer-1 blockchain competitiveness, AB’s innovations in Real-World Assets (RWA), cross-chain interoperability, and DAO governance models.
Event Time: March 13, 2025, 20:00 (UTC+8)
AMA Topic: AB Public Chain: Unlocking the Future of Community Governance
AMA Details & Participation Link:
https://www.htx.com/en-us/live/detail/h5?id=67746&invite_code=sbs66223&inviter_id=11351630
AB DAO Global Ecosystem Continues to Expand
$AB is now available on the following exchanges:
Bitget (bitget.com)
HTX (htx.com)
MEXC (mexc.com)
BingX (bingx.com)
BitMart (bitmart.com)
Hotcoin (hotcoin.com)
UEEx (ueex.com)
4E (eeee.com)
Coming Soon:
Lbank (lbank.com)
Biconomy (biconomy.com)
The listing of $AB on BitMart marks another major step in AB DAO’s global expansion strategy. In the coming months, AB will continue listing on more exchanges, expanding its ecosystem use cases and accelerating worldwide adoption.
AB DAO’s Goal: 100 Million $AB Holders
Stay Updated with AB DAO
Official Website: https://ab.org
Telegram Global Community: https://t.me/Newtonproject
Telegram Chinese Community: http://t.me/ABgonglian
Telegram English Channel: https://t.me/AB202528
X (Twitter): https://x.com/ABDAO_Global
Discord: https://discord.gg/BSbgK6J
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Blockchain Press Releases
BingX Welcomes DeepLink Protocol to Launchpool, Offering 6,666,667 DLC Tokens for Staking
PANAMA CITY, March 12, 2025 /PRNewswire/ — BingX, a global leading cryptocurrency exchange, introduced DeepLink Protocol ($DLC) to its Launchpool, offering its users access to decentralized cloud gaming experience powered by AI and blockchain technology. The staking pools will open from March 14th for 4 days with a total allocation of 6,666,667 DLC tokens. This collaboration aims to accelerate the growth of the web3 gaming ecosystem by supporting the AI, DePIN and decentralized computing industry with cloud-based infrastructure.
Designed for applications like cloud esports, AAA gaming, and remote gaming setups, DeepLink Protocol is transforming cloud gaming on any device by integrating AI Agents, DePIN, decentralized GPU computing, and ultra-low latency cloud rendering into a seamless ecosystem. Supporting 8K visuals and a 1-millisecond response time, it delivers a seamless experience for over 2.7 million users across 120 countries.
Bringing DeepLink Protocol to BingX Launchpool enhances the platform’s value proposition by introducing a new dimension of blockchain-powered gaming. This integration enables BingX users to benefit from DeepLink’s innovative ecosystem at no cost while reinforcing the platform’s position at the forefront of Web3 advancements.
“At BingX, we are committed to connecting our users with the most promising innovations in the Web3 space,” said Vivien Lin, Chief Product Officer of BingX. “DeepLink Protocol represents a game-changing evolution. Through this Launchpool, we empower our users to access and benefit from emerging blockchain ecosystems while reinforcing BingX as a gateway to the future of decentralized applications.”
This Launchpool event gives users the opportunity to easily engage with DeepLink Protocol before its spot trading goes live. This new integration provides early access to innovative blockchain projects while reinforcing BingX’s commitment to bridging decentralized technology with real-world applications.
About BingX
Founded in 2018, BingX is a leading crypto exchange, serving over 20 million users worldwide. BingX offers diversified products and services, including spot, derivatives, copy trading, and asset management – all designed for the evolving needs of users, from beginners to professionals. BingX is committed to providing a trustworthy platform that empowers users with innovative tools and features to elevate their trading proficiency. In 2024, BingX proudly became the official crypto exchange partner of Chelsea Football Club, marking an exciting debut in the world of sports.
For more information please visit: https://bingx.com/
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View original content:https://www.prnewswire.co.uk/news-releases/bingx-welcomes-deeplink-protocol-to-launchpool-offering-6-666-667-dlc-tokens-for-staking-302399771.html
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