Blockchain Press Releases
IDTechEx Discusses Next-Generation RDL Materials in Advanced Semiconductor Packaging
BOSTON, Aug. 11, 2023 /PRNewswire/ — With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology. In the context of interconnected dies on a package, the system’s performance relies heavily on the signaling that happens within the package. Two key metrics, bandwidth and power efficiency, play a pivotal role in determining the success of these advanced semiconductor packaging solutions. In this article, we will focus on the materials requirement for achieving higher bandwidth, one of the essential factors for improved communication between dies.
Bandwidth is a critical performance metric in advanced semiconductor packaging. It refers to the amount of data that can be transmitted or communicated between the dies on the package. Higher bandwidth allows faster and more efficient communication, enabling devices to process data at incredible speeds. Two primary factors are considered to measure bandwidth: IO/mm and Datarate/IO. IO/mm represents the density of I/O connections available on the die edge, while Datarate/IO refers to the data transfer rate of each I/O terminal measured in bps. By multiplying IO/mm by Datarate/IO, we calculate the bandwidth per millimeter of the die edge, which represents the total data that can be transmitted between dies. In simpler terms, bandwidth density indicates the number of bits transmitted and received between dies per mm (for 2D) or per mm2 (for 3D packaging).
The performance of IO/mm and Datarate/IO heavily relies on the redistribution layer (RDL) within the package. Essential features of the RDL, such as Line/Space (L/S), via, and pad dimensions, play a crucial role in achieving optimal performance and data transmission within the package. The dielectric constant of materials used in the redistribution layer (RDL) directly impacts the datarate/IO. Currently, the finest L/S of RDL can be attained using inorganic dielectrics like SiO2, but the material’s relatively high dielectric constant (Dk=3.9) makes it unsuitable for high-speed communication. Additionally, the process is also challenging and costly. As a result, researchers are actively exploring alternative dielectric materials, particularly organic options, which offer the advantages of lower dielectric constants and reduced costs. When selecting organic dielectric materials, several key parameters must be considered to ensure their suitability for the packaging process. IDTechEx’s “Materials and Processing for Advanced Semiconductor Packaging 2024-2034” report identifies five key parameters crucial for organic dielectrics used in advanced semiconductor packaging.
Dk (Dielectric Constant) and Df (Loss Tangent):
A material’s dielectric constant (Dk) determines its ability to support higher data rates without compromising signal integrity. Materials with low Dk are preferred for advanced semiconductor packaging as they reduce wire capacitance and allow for shorter interconnects between dies. Low-loss characteristics also minimize transmission loss in high-frequency communication devices, further enhancing bandwidth.
Elongation to Failure:
For multi-layer RDL (Redistribution Layer) with a higher copper coverage on each layer, a higher elongation to failure is favorable. This property ensures the material can withstand the stresses and strains associated with the packaging process and device operation without mechanical failure.
CTE (Coefficient of Thermal Expansion):
To ensure package reliability, the dielectric material should have a CTE similar to that of the copper metal layer. However, achieving this is challenging due to the inability to use filler particles that increase the dielectric permittivity of the polymer. SiO2 fillers, commonly used in polymer dielectrics, do not aid in reducing the Dk value as they need to be loaded in high volume. Additionally, the presence of fillers hinders the scaling of microvias, which are essential for advanced packaging technologies.
Young’s Modulus:
For a reliable microvia design with a diameter of less than 5 µm, utilizing a polymer material with a low Young’s modulus is crucial. A low modulus helps minimize the stress exerted on the copper, leading to enhanced overall package reliability.
Moisture Absorption:
Moisture absorption of the polymer material is crucial for long-term system reliability. High moisture absorption can lead to delamination and negatively impact both mechanical and electrical performance.
In conclusion, as technology continues to advance, the demand for even higher bandwidth and power efficiency in advanced semiconductor packaging will persist. Organic dielectrics have garnered significant interest due to their potential in offering low dielectric constant (Dk) characteristics, enhanced defect tolerance, and cost-effectiveness. However, it is crucial to acknowledge that selecting the appropriate material always involves trade-offs. For instance, while low dielectric constant polymers offer advantages, they may come with a higher coefficient of thermal expansion (CTE), which can adversely affect device reliability and packaging architectures. Therefore, it becomes imperative to carefully consider and adhere to the five key features and their requirements to ensure the successful development of advanced semiconductor packaging solutions.
IDTechEx’s “Materials and Processing for Advanced Semiconductor Packaging 2024-2034” report offers a structured approach to understanding advanced semiconductor packaging. The report is divided into four main parts. The first part provides a comprehensive introduction to technologies, development trends, key applications, and the ecosystem of advanced semiconductor packaging. The second part focuses on 2.5D packaging processes, including dielectric materials, RDL fabrication techniques, and material selection for EMC and MUF. The third part delves into the innovative Cu-Cu hybrid bonding technology for 3D die stacking, offering insights into the manufacturing process and material selection. The report also includes a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, providing valuable perspectives on market growth and trends for the coming decade.
To find out more about this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/MatsforASP.
IDTechEx’s market research is differentiated through the primary information gathered, technical depth, and unbiased appraisals. IDTechEx covers a wide range of topics and helps understand the industry’s pain points and unmet needs. For more information, please visit www.IDTechEx.com/research.
About IDTechEx
IDTechEx guides your strategic business decisions through its Research, Subscription and Consultancy products, helping you profit from emerging technologies. For more information, contact [email protected] or visit www.IDTechEx.com.
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Blockchain Press Releases
MEXC Announces Listing of Hyperlane (HYPER) with a 165,000 HYPER and 50,000 USDT Prize Pool
VICTORIA, Seychelles, April 21, 2025 /PRNewswire/ — MEXC, a leading global cryptocurrency exchange, announced the Hyperlane (HYPER) listing on April 22, 2025(UTC).To celebrate this significant addition to the exchange, MEXC is launching a special event with a prize pool of 165,000 HYPER and 50,000 USDT for new and existing users.
Hyperlane is the first permissionless, universal interoperability protocol dedicated to building a truly open and decentralized cross-chain communication infrastructure. As “The Open Interoperability Framework,” it enables anyone to freely expand, utilize, and customize the network, allowing developers to easily and securely build cross-chain applications and token bridges. To date, Hyperlane has connected over 140 blockchains, processed nearly 9 million cross-chain messages, and bridged more than $6 billion in volume through its Warp Routes.
$HYPER is the native token of the Hyperlane ecosystem, with an initial total supply of 1 billion tokens. It plays a critical role in securing the protocol through staking, rewarding validators for verifying cross-chain messages, incentivizing user-driven activity, and enabling community governance over protocol development.
To celebrate the listing, MEXC will launch an Airdrop+ event with substantial rewards for users:
Event Period: April 21, 2025, 10:00 – May 01, 2025, 10:00 (UTC)
Benefit 1: Deposit and share 120,000 HYPER (New user exclusive)
Benefit 2: Spot Challenge — Trade to share 15,000 HYPER (For all users)
Benefit 3: Futures Challenge — Trade to share 50,000 USDT in Futures bonus (For all users)
Benefit 4: Invite new users and share 30,000 HYPER (For all users)
MEXC has established itself as a leading exchange by consistently offering users early access to high-potential crypto assets. In 2024 alone, the platform listed 2,376 new tokens, including 1,716 initial listings. According to the latest TokenInsight report, MEXC led the industry with 461 spot listings between November 1, 2024, and February 15, 2025. During this period, the exchange maintained a high listing frequency, consistently ranking among the top six platforms, demonstrating its agility in capturing emerging market trends. MEXC will continue to expand its asset offerings and help users seize timely opportunities in the fast-moving crypto market.
For full event details and participation rules, please visit here.
About MEXC
Founded in 2018, MEXC is committed to being “Your Easiest Way to Crypto.” Serving over 36 million users across 170+ countries, MEXC is known for its broad selection of trending tokens, everyday airdrop opportunities, and low trading fees. Our user-friendly platform is designed to support both new traders and experienced investors, offering secure and efficient access to digital assets. MEXC prioritizes simplicity and innovation, making crypto trading more accessible and rewarding.
MEXC Official Website｜ X ｜ Telegram ｜How to Sign Up on MEXC
Risk Disclaimer:
The information provided in this article regarding cryptocurrencies does not constitute investment advice. Given the highly volatile nature of the cryptocurrency market, investors are encouraged to carefully assess market fluctuations, the fundamentals of projects, and potential financial risks before making any trading decisions.
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Blockchain Press Releases
Introducing Clementine Bridge: Citrea Deploys First Complete BitVM Bridge Design on Testnet
Citrea’s Clementine Bridge marks the first time that a fully programmable layer is tested for settling on Bitcoin.
GEORGE TOWN, Cayman Islands, April 21, 2025 /PRNewswire/ — Citrea, the first ZK rollup to enhance capabilities of Bitcoin blockspace and enable Bitcoin applications (₿apps), has successfully deployed its Clementine Bridge, the first complete BitVM bridge design on Bitcoin Testnet. Citrea has also recently revealed Clementine’s whitepaper, marking the first real-world implementation of a BitVM-based bridge which extends BTC’s utility to decentralized finance in the most Bitcoin-secured and native way possible. With Clementine’s testnet deployment, Bitcoin is for the first time tested for optimistically verifying a fully programmable layer. The Clementine whitepaper is currently the only documentation of how to use BitVM in a bridge design with clear solutions toward a secure and efficient bridge implementation.
Despite being the world’s largest digital asset, BTC has struggled to build relevance in decentralized finance. A secure bridge between Bitcoin and a secondary layer has always been a bottleneck for using BTC in a programmable environment. This problem has forced users to either keep Bitcoin as a passive store of value or rely on custodians for using BTC in financial activities. Citrea’s BitVM-based Bitcoin bridge Clementine solves this by enabling the safest and most trust-minimized way to bridge BTC and extend its utility to decentralized finance.
Citrea’s Clementine bridge marks a historic moment for Bitcoin and a new beginning for BTC’s utility. “It felt like magic when we saw all the bridge components work smoothly in our internal tests and that any malicious act is stopped by a single honest actor,” said Ekrem Bal, Co-Creator of Citrea. “We’re now ready to test Clementine in a real Bitcoin Testnet environment and make it more battle-tested for Citrea mainnet.”
With the introduction of BitVM by a Bitcoin developer Robin Linus, verifying computations on Bitcoin and building Bitcoin-secured bridges became a possibility. Very soon after its introduction, Citrea team became a core contributor of BitVM and later a founding member of BitVM alliance, where BitVM’s fundamental technology of executing a fraud proof of a zero-knowledge (ZK) proof on Bitcoin was developed collaboratively. Although accomplishing a ZK proof verification on Bitcoin was a prerequisite, there were still critical problems to address to implement this fundamental technology securely and efficiently into a Bitcoin bridge design. A detailed breakdown of this can be found in Clementine’s whitepaper.
Clementine’s design and whitepaper introduce novel solutions to two main research topics in BitVM-based bridge implementation, namely Bitcoin chain fork selection and capital efficiency of operators. These topics have been critical to solve as they ensure both the bridge’s security and efficiency. Citrea’s Clementine bridge offers clear solutions to both of these problems:
- Bitcoin Chain Fork Selection: This is related to ensuring that the bridge follows the longest Bitcoin chain. It has been an open research topic where the BitVM creator introduced superblocks approach but its security was later found to be broken. Citrea introduces a new Bitcoin Light Client design that uses succinct Header Chain Proofs of Bitcoin. These proofs are aggregated by operators into a single BitVM proof.
- Capital Efficiency of Operators: This has been another limitation of implementing BitVM efficiently into a bridge design. With Citrea’s approach to non-standard Bitcoin transactions, operators can now process hundreds of withdrawals in parallel with a single collateral. Disproving only one withdrawal is enough to stop other malicious withdrawal processes.
Clementine’s design relies on zero-knowledge proofs, Bitcoin data availability, a novel Bitcoin Light Client design and BitVM. In the case of a malicious act, an honest watchtower provides a proof of the longest Bitcoin chain. Then the operator generates a proof verifying Citrea’s state, watchtowers’ challenges and payout for the withdrawal. If the operator is malicious, it won’t be able to generate such proof, resulting in slashing the operator. Clementine has three main bridge actors to ensure the system’s integrity:
- Signers enforce BitVM spendings by managing peg-ins through presign transactions
- Watchtowers are tasked with monitoring operators and challenging any malicious behavior by sending a proof of longest Bitcoin chain
- Operators, a group of profit-seeking entities, temporarily cover users’ withdrawals and are later reimbursed with presigned transactions.
Citrea: Bitcoin’s Application (₿app) Layer
Citrea extends Bitcoin’s utility without sacrificing its security. With zero-knowledge technology, Citrea enables Bitcoin to function as a fully programmable layer. With its Bitcoin bridge Clementine, Citrea offers the safest and most trust-minimized way to bridge BTC to a fully programmable secondary layer.
For the first time in its history, Bitcoin Network will be able to support diverse on-chain applications and its utility will be extended to decentralized finance.
Apply to Citrea’s unique incubation program ‘Citrea Origins‘ to build ₿apps.
For more information, please visit: Citrea website | Citrea X Account
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PANAMA CITY, April 21, 2025 /PRNewswire/ — BingX, a global leading cryptocurrency exchange, announces the listing of EPT, the native token for Balance.fun, for both spot trading and also on the BingX Xpool. The spot listing will commence on April 21 at 12:00 (UTC) while the Xpool launch will start on April 22 at 10:00 (UTC). BingX users can stake BTC and EPT in Xpool, though new users will have an additional option to stake USDT to win a bigger share of the reward pool that includes 2,000,000 EPT Points. The first 1000 new users who stake a minimum of 100 USDT will also be able to earn an additional bonus voucher worth 100 USDT.
EPT is the governance token of Balance, an AI-powered web3 experience infrastructure designed for the masses. This new digital asset will fuel the new Balance Platform to create an open and inclusive gaming ecosystem for both gamers and developers with fairness at its core. With the integration of AI and blockchain technology, games can be built and marketed more easily while allowing players to benefit from the enhanced and diversified gaming experience.
Users of the existing Epal platform can transfer their EPT tokens to BingX, enabling a reliable method to trade EPT or, alternatively, purchase EPT for governance purposes. Having a solid exchange to further explore the vast world of cryptocurrencies, this new listing further empowers both Epal and Balance users in the process.
Vivien Lin, Chief Product Officer of BingX, shared her thoughts on the new trading option and Xpool listing: “I think providing users with these new trading and early investment options is our responsibility as a responsible cryptocurrency exchange since some of our users rely on us to introduce such projects with such numerous functions across multiple subcategories”.
Visit bingx.com to join the Xpool starting April 22 and start trading EPT on spot from April 21. Whether you’re a gamer, builder, or crypto enthusiast, this is your chance to be part of a new decentralized chapter in entertainment.
About BingX
Founded in 2018, BingX is a leading crypto exchange, serving over 20 million users worldwide. BingX offers diversified products and services, including spot, derivatives, copy trading, and asset management – all designed for the evolving needs of users, from beginners to professionals. BingX is committed to providing a trustworthy platform that empowers users with innovative tools and features to elevate their trading proficiency. In 2024, BingX proudly became the official crypto exchange partner of Chelsea Football Club, marking an exciting debut in the world of sports.
For more information, please visit: https://bingx.com/
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