Blockchain Press Releases
Vention becomes Universal Robots’ Certified Solution Partner
Vention and Universal Robots are strengthening their partnership to provide best-in-class automation solutions in record time for all manufacturers and automation providers.
MONTREAL, July 12, 2023 /PRNewswire/ — A UR+ partner since 2017, Vention, the cloud-based Manufacturing Automation Platform (MAP) company, is proud to announce its strengthened partnership with Universal Robots becoming one of a few select Certified Solution Partners (CSP). This new CSP certification further validates the compatibility of Vention and Universal Robots’ hardware and software ecosystems.
Throughout the partnership between Vention and Universal Robots thus far, Vention has developed a large portfolio of UR+-certified components and applications, including cobot palletizer, MachineLogic, MachineMotion, Cobot range extender, and other varied certified hardware components. Through the addition of these components to Vention’s custom robot cells and application offerings, users can take full advantage of Vention’s modular and customizable solutions to create UR-based robot cells and applications in record time, resulting in fast payback for manufacturers and automation providers.
“Over the years, Vention has supported over 1,000 Universal Robot deployments in North America and Europe, giving Vention unique expertise in the design and deployment of collaborative solutions,” said Patrick Halde, Chief Growth Officer at Vention. “With Vention’s simplified approach to industrial automation being very similar to Universal Robots, becoming a Certified Solution Partner was the logical next step in our partnership.”
Bryan Bird, Regional Sales Director of Universal Robots’ North America division, looks forward to building a network of CSPs with specific UR product, software, and application expertise. “Our new CSP program recognizes deployment excellence and commitment to increased integration capacity, all to the benefit of our customers,” he says. “Vention is a great fit for this program, and we are excited to deploy even more cobot applications together, taking our partnership to the next level.”
Together, with Vention’s modular and plug-and-play solutions and Universal Robots cobot product range, Vention and Universal Robots can offer manufacturers the best-in-class solutions in a streamlined and flexible process to achieve their business objectives. Moving forward, Vention will continue to develop UR solutions through new applications and software releases.
“We are only scratching the surface of what can be done when combining intuitive software, modular hardware, and robots,” added Patrick Halde, Chief Growth Officer at Vention.
Vention helps some of the most innovative manufacturers automate their production floors in just a few days through a democratized user experience. Vention’s digital manufacturing automation platform allows clients to design, automate, order, and deploy automated equipment directly from their web browsers. Vention is headquartered in Montreal, Canada, with new offices in Berlin and Boston. The 360-person company serves 3,000+ customers on five continents and 25 manufacturing industries. To learn more, visit vention.io or follow us on LinkedIn.
*MachineMotion, MachineLogic, MachineCloud, and Vention are trademarks of Vention Inc.
Universal Robots aims to empower change in the way work is done using its leading-edge robotics platform. Since introducing the world’s first commercially viable collaborative robot (cobot) in 2008, UR has developed a product portfolio including the UR3e, UR5e, UR10e, UR16e and UR20, reflecting a range of reaches and payloads. Each model is supported by a wide selection of end-effectors, software, accessories and application kits in the UR+ ecosystem. This allows the cobots to be used across a wide range of industries and means that they can be redeployed across diverse tasks.
The company, which is part of Teradyne Inc., is headquartered in Odense, Denmark, and has offices in the USA, Germany, France, Spain, Italy, the Czech Republic, Romania, Turkey, China, India, Japan, South Korea, Singapore, and Mexico. Universal Robots has installed over 75,000 cobots worldwide.
For more information, please visit www.universal-robots.com or read our blog at blog.universal-robots.com.
Media Contact: Sophie Ducharme, [email protected], 1 800 940-3617
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“The Game is On”
TAIPEI, Jan. 23, 2025 /PRNewswire/ — TiltPlay, a gaming platform offering fast-paced and engaging casual games, is proud to announce its official launch on the Soneium ecosystem. This launch positions TiltPlay as dynamic, skill-focused gaming experience to the Web3 space.
TiltPlay combines accessible gameplay with innovative technology to deliver a seamless experience across platforms, including Telegram mini-apps and web browsers. The platform’s unique approach introduces:
- Exciting Game Variety: A growing library of casual games designed to challenge and entertain.
- Skill-Based Progression: Players are rewarded for their mastery and expertise, ensuring a fair and fun competitive environment.
- Web3 Integration: Built on Soneium, providing a decentralized and secure gaming experience.
“With TiltPlay, we’re redefining mini-games by putting fun and skill at the forefront,” said Jeffrey Huang, Product Director at TiltPlay. “Our collaboration with the Soneium ecosystem allows us to deliver a platform that’s accessible, enjoyable, and innovative for all players.”
TiltPlay is now live, inviting gamers worldwide to dive into its features, test their skills, and connect with a vibrant community.
For more information about TiltPlay, visit TiltPlay.gg.
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View original content:https://www.prnewswire.co.uk/news-releases/tiltplay-launches-as-a-gaming-platform-on-the-soneium-ecosystem-302357392.html
Blockchain Press Releases
Purchasers of Quantstamp QSP Tokens May Be Eligible for Payment from the Quantstamp Fair Fund
COSTA MESA, Calif., Jan. 22, 2025 /PRNewswire/ — The following statement is being issued by Simpluris, Inc., the SEC-appointed Fund Administrator.
UNITED STATES OF AMERICA
Before the
SECURITIES AND EXCHANGE COMMISSION
In the Matter of Quantstamp, Inc.
Administrative Proceeding File No. 3-21535
This Notice is Pursuant to a Distribution Plan approved by the United States Securities and
Exchange Commission in the captioned matter.
If you purchased or acquired Quantstamp QSP tokens from October 1, 2017, through July 20, 2023, inclusive, you may be eligible for a distribution from the Fair Fund created in the Securities and Exchange Commission (“SEC”) administrative proceeding captioned above (the “Fair Fund”).
The Fair Fund is being distributed pursuant to a Distribution Plan (the “Plan”) approved by the SEC. The Plan provides for the distribution of the Fair Fund to compensate investors based on their losses, due to the misconduct of Quantstamp, Inc. described in the SEC’s administrative proceeding, on the purchase of QSP tokens from October 1, 2017 through July 20, 2023. You can view and download a copy of the SEC’s order and the Plan on the Important Documents tab on the website for this matter: www.QuantstampFairFund.com/documents.
To be considered for eligibility for a Distribution Payment from the Fair Fund, you must timely submit a completed Claim Form online or via mail. Claim Forms completed online must be submitted on or before 11:59 p.m. Eastern Standard Time (“EST”) on April 10, 2025. Claim Forms submitted via mail must be sent to the address provided on the Claim Form and postmarked (or if not sent by U.S. Mail, received) by April 10, 2025.
You may complete the Claim Form online here: www.QuantstampFairFund.com/form/claim. Alternatively, you may download a paper copy from of the Claim Form on the Important Documents page www.QuantstampFairFund.com/documents, or request a copy of the paper Claim Form from the Fund Administrator via email at [email protected] or by calling 833-215-6101, for submission by mail to the address set forth on the Claim Form.
ADDITIONAL INFORMATION
Additional information regarding the Fair Fund, including copies of the Plan, the Plan Notice, the Claim Form, and other relevant documents may be found at www.QuantstampFairFund.com. You may request copies or seek additional information by contacting the Fund Administrator.
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Email: |
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Call: |
833-215-6101 |
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Write: |
Quantstamp Fair Fund |
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Fund Administrator |
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P.O. Box 25381 |
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Santa Ana, CA 92799 |
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Blockchain
Humanity Protocol Collaborates with OKX Wallet to Redefine Decentralized Identity Verification and Reward Users
The post Humanity Protocol Collaborates with OKX Wallet to Redefine Decentralized Identity Verification and Reward Users appeared first on News, Events, Advertising Options.
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