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Blockchain Press Releases

IDTechEx Explores Materials and Processing for Advanced Semiconductor Packaging

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BOSTON, July 5, 2023 /PRNewswire/ — 

Why Is Advanced Semiconductor Packaging Needed?

This is a data-centric world. The growing amount of data generated in various industries increasingly drives the demand for high-bandwidth computing. Applications such as machine learning and AI require powerful processing capabilities, leading to the need for dense transistor placement on chips and compact interconnection bump pitches in packaging. The latter highlights the significance of semiconductor technologies in meeting these requirements.

Semiconductor packaging has evolved from board-level to wafer-level integration, bringing notable advancements. Wafer level integration provides advantages over traditional methods, such as increased connection density, smaller footprints for size-sensitive applications, and enhanced performance.

“Advanced” semiconductor packaging specifically includes high-density fan-out, 2.5D, and 3D packaging, characterized by a bumping pitch size below 100 µm, enabling at least 10x higher interconnect densities.

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Bandwidth Is Key

To enhance bandwidth from a packaging perspective, two key factors come into play: the total number of I/Os (input/output) and the bit rate per each I/O. Increasing the total number of I/Os requires enabling finer line/space (L/S) patterns in each routing layer/redistribution layer (RDL) and having a higher number of routing layers. On the other hand, improving the bit rate per I/O is influenced by the interconnect distance between chiplets and the selection of dielectric materials. These factors directly impact the overall performance and efficiency of the packaging system.

Unleashing High Bandwidth: Exploring Materials and Processing for Advanced Semiconductor Packaging

Delving deeper into achieving higher wiring density and a higher bit rate per I/O from a materials and processing perspective reveals the critical role played by the selection of dielectric materials and the utilization of appropriate processing techniques. These factors have a significant impact on the overall performance and capabilities of the packaging system.

Selecting suitable dielectric materials is crucial, considering properties like low dielectric constant, optimal CTE (as close to the CTE of Cu as possible), and favorable mechanical characteristics that ensure module reliability, such as Young’s modulus and elongation. These choices enable higher data rates while preserving signal integrity and facilitating fine line/space features for increased wiring density.

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In high-performance accelerators, such as GPUs, inorganic dielectrics like SiO2 have been extensively utilized to achieve ultra-fine line/space (L/S) features. Nevertheless, their use is limited in applications that demand high-speed connectivity due to their high RC delays. As an alternative, organic dielectrics have been proposed for their cost-effectiveness and ability to mitigate RC delays through their low dielectric constant. However, organic dielectrics present challenges, including high CTE, which can negatively impact the device’s reliability, and difficulties in scaling to fine L/S features.

In addition to selecting appropriate materials, the processing techniques employed during packaging fabrication play a crucial role in achieving a higher number of I/Os and improving the bit rate per I/O. The steps involved in 2.5D packaging processes, including lithography, CMP (Chemical Mechanical Planarization), etching processes, and the CMP and bonding processes in 3D Cu-Cu hybrid bonding, present challenges in achieving tighter routing and increased wiring density. IDTechEx provides detailed insights into how the choice of materials influences the fabrication processes, offering a comprehensive understanding of their impact on advanced semiconductor packaging.

Materials and Technologies Covered in the IDTechEx Report

IDTechEx’s “Materials and Processing for Advanced Semiconductor Packaging 2024-2034” report is divided into four main parts, offering a structured approach to understanding advanced semiconductor packaging. The first part provides a comprehensive introduction to the technologies, development trends, key applications, and ecosystem of advanced semiconductor packaging, providing readers with a solid overview. The second part focuses on 2.5D packaging processes, delving into crucial aspects, including dielectric materials for RDL and Microvia, RDL fabrication techniques, and material selection for EMC and MUF. Each sub-section within this part presents a detailed analysis of process flows, technology benchmarks, player evaluations, and future trends, providing readers with comprehensive insights.

The report continues beyond the discussion of 2.5D packaging to the third part, which focuses on the innovative Cu-Cu hybrid bonding technology for 3D die stacking. This section provides valuable insights into the manufacturing process and offers guidance on material selection for optimal outcomes. It also showcases case studies highlighting the successful implementation of Cu-Cu hybrid bonding using both organic and inorganic dielectrics. Additionally, the report includes a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, presented in the last chapter. This forecast encompasses unit and area metrics, providing the industry with meaningful perspectives into anticipated market growth and trends for the next decade.

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To find out more about this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/MatsforASP.

About IDTechEx

IDTechEx guides your strategic business decisions through its Research, Subscription and Consultancy products, helping you profit from emerging technologies. For more information, contact [email protected] or visit www.IDTechEx.com.

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Media Contact:

Lucy Rogers

Sales and Marketing Administrator

[email protected] 

+44(0)1223 812300

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Social Media Links:

Twitter: www.twitter.com/IDTechEx

LinkedIn: www.linkedin.com/company/IDTechEx 

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Blockchain Press Releases

Bybit’s CEO Meets with Vietnam’s Minister of Finance to Support Regulatory Sandbox and Strengthen Crypto Compliance

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DUBAI, UAE, April 19, 2025 /PRNewswire/ — Ben Zhou, Co-founder and CEO of Bybit, one of the world’s second-largest cryptocurrency exchanges by trading volume, met with H.E. Nguyen Van Thang, Minister of Finance of Vietnam, to express Bybit’s strong support for the country’s regulatory sandbox initiative and its vision to build a safe, transparent, and innovation-friendly digital asset ecosystem.

Hosted at the Ministry of Finance headquarters, the meeting centered on Vietnam’s efforts to establish a comprehensive legal framework for crypto assets. Minister Nguyen Van Thang outlined the Government’s plan to launch a pilot sandbox mechanism that will allow regulators to test the issuance and trading of crypto assets in a controlled environment. This initiative is designed to mitigate risks, strengthen investor protection, and ensure regulatory readiness before introducing official legislation.

A key part of the discussion focused on safeguarding the market against illicit activities. The Minister emphasized the importance of robust compliance frameworks, including Anti-Money Laundering (AML) and Know Your Customer (KYC) protocols, to prevent the misuse of digital assets and support the country’s financial security.

In response, Ben Zhou welcomed Vietnam’s measured and responsible approach to digital asset regulation and reiterated Bybit’s long-standing commitment to compliance:

Vietnam’s forward-thinking regulatory sandbox is a critical step toward unlocking the full potential of blockchain technology. At Bybit, we are fully aligned with the Government’s focus on investor protection and financial integrity,” said Ben Zhou, Co-founder and CEO of Bybit. “We are proud to share our expertise in KYC, AML, and global compliance standards, and we look forward to supporting Vietnam in building a resilient, secure, and dynamic crypto economy.”

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Bybit expressed its readiness to collaborate with Vietnamese authorities on several fronts, including system architecture design, transaction oversight, and the implementation of international best practices in AML/KYC. The exchange also proposed support in capacity building, such as training financial regulators and sharing experiences from other jurisdictions.

Minister Nguyen Van Thang welcomed Bybit’s proactive approach and assigned the State Securities Commission to coordinate with Bybit on concrete proposals. He also commended Bybit’s reputation for strong financial capabilities, technological resilience, and its adherence to legal and regulatory requirements in the markets where it operates.

This meeting underscores Bybit’s growing role as a trusted international partner for regulatory dialogue and innovation. It also highlights Vietnam’s readiness to embrace blockchain technology while ensuring financial safety and public confidence in the digital asset space.

About Bybit

Bybit is the world’s second-largest cryptocurrency exchange by trading volume, serving a global community of over 60 million users. Founded in 2018, Bybit is redefining openness in the decentralized world by creating a simpler, open and equal ecosystem for everyone. With a strong focus on Web3, Bybit partners strategically with leading blockchain protocols to provide robust infrastructure and drive on-chain innovation. Renowned for its secure custody, diverse marketplaces, intuitive user experience, and advanced blockchain tools, Bybit bridges the gap between TradFi and DeFi, empowering builders, creators, and enthusiasts to unlock the full potential of Web3. Discover the future of decentralized finance at Bybit.com.

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For more details about Bybit, please visit Bybit Press.
For media inquiries, please contact: [email protected]
For updates, please follow: Bybit’s Communities and Social Media

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Blockchain Press Releases

Bybit launches Crypto Surf: Copy Traders and Bots Battle for 250K USDT

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DUBAI, UAE, April 18, 2025 /PRNewswire/ — Bybit, the world’s second-largest cryptocurrency exchange by trading volume, is making waves with its latest trading showdown: Crypto Surf: Ride the Waves with Trailing Stops. This high-octane competition invites traders to rally behind either copy trading or trading bots, battling it out for their share of a prize pool worth up to $250,000 in USDT.

Running from April 18 to May 19, 2025, at 12 a.m. UTC, the event introduces a squad-based structure where users choose their camp, trade strategically, and compete across PnL, ROI and trading volume leaderboards. With a dynamic reward structure, participants can also win by predicting which squad will come out on top.

Prize Pool Distribution Highlights:

  • 40% to the champion squad
  • 30% to the runner-up 
  • 25% to the top 100 individual traders by volume
  • 5% to users who correctly predict the winning squad

The event brings together the best of both worlds: the strategic finesse of copy trading and the automated power of trading bots. It celebrates innovation, user choice, and the thrill of crypto trading.

Participants must hold a minimum wallet balance of $1,000 in USDT, generate at least $10,000 in squad volume, and complete identity verification Level 1 to qualify. Users can only register for one squad and vote once to predict the winner. Rewards will be distributed within 14 business days of the event’s completion.

The total prize pool will scale in line with event volume milestones, starting at $1.2 billion and unlocking up to $2 billion in traded volume for the full $250,000 in USDT.

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Bybit continues to redefine the competitive trading landscape – bringing fun, strategy and serious rewards to its global community.

#Bybit / #TheCryptoArk

About Bybit

Bybit is the world’s second-largest cryptocurrency exchange by trading volume, serving a global community of over 60 million users. Founded in 2018, Bybit is redefining openness in the decentralized world by creating a simpler, open, and equal ecosystem for everyone. With a strong focus on Web3, Bybit partners strategically with leading blockchain protocols to provide robust infrastructure and drive on-chain innovation. Renowned for its secure custody, diverse marketplaces, intuitive user experience, and advanced blockchain tools, Bybit bridges the gap between TradFi and DeFi, empowering builders, creators, and enthusiasts to unlock the full potential of Web3. Discover the future of decentralized finance at Bybit.com.

For more details about Bybit, please visit Bybit Press
For media inquiries, please contact: [email protected]
For updates, please follow: Bybit’s Communities and Social Media

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Blockchain Press Releases

Tomorrowland Brasil 2025 General Sale in Full Swing — Exclusive Cashback for Bybit Cardholders

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DUBAI, UAE, April 18, 2025 /PRNewswire/ — Bybit, the world’s second-largest cryptocurrency exchange by trading volume, highlights that general ticket sales for Tomorrowland Brasil 2025 are currently ongoing, with exclusive benefit available to Bybit Card and Bybit Pay eligible users such as 20% cashback.

The Bybit Card is designed for global use and supports both fiat currencies—ARS, BRL, EUR, USD—and a wide selection of cryptocurrencies. Integrated with Apple Pay, Google Pay, and Samsung Pay, it offers users up to 10% cashback on everyday purchases, 8% APR through Auto-Savings, free worldwide delivery, and $100 in monthly ATM withdrawals at no cost—without any annual fees.

Returning to the vibrant setting of Parque Maeda in Itu, São Paulo, Tomorrowland Brasil 2025 will take place from October 12 to 14, promising three days of music, imagination, and cultural exchange. Famed for its theatrical stages, global audience, and meticulously curated lineup, Tomorrowland is more than a festival—it’s a world of its own. With each edition, it transforms into a breathtaking playground of light, sound, and storytelling, drawing music lovers from over 100 countries to celebrate unity through electronic music.

This year’s Brazilian edition will feature performances from some of the world’s most sought-after artists, including David Guetta, Armin van Buuren, Vintage Culture, Mind Against, Steve Aoki, James Hype, Alesso, Nervo, and I Hate Models. Special acts include Alok’s “Something Else” concept, ANNA b2b Vintage Culture, and a powerful b2b set from Matisse & Sadko and Third Party. With more names still to be revealed, the event is shaping up to be one of the strongest editions yet.

“Tomorrowland Brasil is one of those rare experiences that transcends music—it creates lasting memories and connects people from every walk of life,” said Joan Han, Head of Payment business unit at Bybit. “We’re proud to support this global celebration by offering our users exclusive benefits that make it easier to be part of something truly unforgettable.”

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Tomorrowland Brasil continues to be a beacon of creativity, community, and connection, standing at the intersection of music, technology, and art.

#Bybit / #TheCryptoArk

About Bybit

Bybit is the world’s second-largest cryptocurrency exchange by trading volume, serving a global community of over 60 million users. Founded in 2018, Bybit is redefining openness in the decentralized world by creating a simpler, open and equal ecosystem for everyone. With a strong focus on Web3, Bybit partners strategically with leading blockchain protocols to provide robust infrastructure and drive on-chain innovation. Renowned for its secure custody, diverse marketplaces, intuitive user experience, and advanced blockchain tools, Bybit bridges the gap between TradFi and DeFi, empowering builders, creators, and enthusiasts to unlock the full potential of Web3. Discover the future of decentralized finance at Bybit.com.

For more details about Bybit, please visit Bybit Press
For media inquiries, please contact: [email protected]
For updates, please follow: Bybit’s Communities and Social Media

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About TOMORROWLAND BRASIL

Tomorrowland Brasil 2025 will take place on October 10-12 in the beautiful festival area of Parque Maeda in Itu, a municipality in São Paulo. The festival will revolve around the mesmerizing ‘LIFE’ theme, set against the backdrop of Brazil’s enchanting natural beauty. A story set in the mythical realm of Silvyra, it’s a world unto its own, filled with creatures, plant life, and people living in harmony, each with their own stories, with the diversity of Silvyra’s lush nature represented in the spectacular ‘LIFE’ Mainstage. Offering the ultimate escape from the city during three days of bliss, guests will be treated to breathtaking performances by more than 150 of the world’s finest electronic artists across 6 mesmerizing stages.

The first two festival editions of Tomorrowland Brasil took place in 2015 and 2016 in the beautiful festival area of Parque Maeda in Itu, São Paulo. After years of dreaming of a return, Tomorrowland finally headed back to Brazil in 2023, becoming a yearly highlight once again.

Tomorrowland Brasil 2025
October 10-12, 2025
Parque Maeda, Itu
brasil.tomorrowland.com

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