Blockchain Press Releases
IDTechEx Explores Materials and Processing for Advanced Semiconductor Packaging
BOSTON, July 5, 2023 /PRNewswire/ —
Why Is Advanced Semiconductor Packaging Needed?
This is a data-centric world. The growing amount of data generated in various industries increasingly drives the demand for high-bandwidth computing. Applications such as machine learning and AI require powerful processing capabilities, leading to the need for dense transistor placement on chips and compact interconnection bump pitches in packaging. The latter highlights the significance of semiconductor technologies in meeting these requirements.
Semiconductor packaging has evolved from board-level to wafer-level integration, bringing notable advancements. Wafer level integration provides advantages over traditional methods, such as increased connection density, smaller footprints for size-sensitive applications, and enhanced performance.
“Advanced” semiconductor packaging specifically includes high-density fan-out, 2.5D, and 3D packaging, characterized by a bumping pitch size below 100 µm, enabling at least 10x higher interconnect densities.
Bandwidth Is Key
To enhance bandwidth from a packaging perspective, two key factors come into play: the total number of I/Os (input/output) and the bit rate per each I/O. Increasing the total number of I/Os requires enabling finer line/space (L/S) patterns in each routing layer/redistribution layer (RDL) and having a higher number of routing layers. On the other hand, improving the bit rate per I/O is influenced by the interconnect distance between chiplets and the selection of dielectric materials. These factors directly impact the overall performance and efficiency of the packaging system.
Unleashing High Bandwidth: Exploring Materials and Processing for Advanced Semiconductor Packaging
Delving deeper into achieving higher wiring density and a higher bit rate per I/O from a materials and processing perspective reveals the critical role played by the selection of dielectric materials and the utilization of appropriate processing techniques. These factors have a significant impact on the overall performance and capabilities of the packaging system.
Selecting suitable dielectric materials is crucial, considering properties like low dielectric constant, optimal CTE (as close to the CTE of Cu as possible), and favorable mechanical characteristics that ensure module reliability, such as Young’s modulus and elongation. These choices enable higher data rates while preserving signal integrity and facilitating fine line/space features for increased wiring density.
In high-performance accelerators, such as GPUs, inorganic dielectrics like SiO2 have been extensively utilized to achieve ultra-fine line/space (L/S) features. Nevertheless, their use is limited in applications that demand high-speed connectivity due to their high RC delays. As an alternative, organic dielectrics have been proposed for their cost-effectiveness and ability to mitigate RC delays through their low dielectric constant. However, organic dielectrics present challenges, including high CTE, which can negatively impact the device’s reliability, and difficulties in scaling to fine L/S features.
In addition to selecting appropriate materials, the processing techniques employed during packaging fabrication play a crucial role in achieving a higher number of I/Os and improving the bit rate per I/O. The steps involved in 2.5D packaging processes, including lithography, CMP (Chemical Mechanical Planarization), etching processes, and the CMP and bonding processes in 3D Cu-Cu hybrid bonding, present challenges in achieving tighter routing and increased wiring density. IDTechEx provides detailed insights into how the choice of materials influences the fabrication processes, offering a comprehensive understanding of their impact on advanced semiconductor packaging.
Materials and Technologies Covered in the IDTechEx Report
IDTechEx’s “Materials and Processing for Advanced Semiconductor Packaging 2024-2034” report is divided into four main parts, offering a structured approach to understanding advanced semiconductor packaging. The first part provides a comprehensive introduction to the technologies, development trends, key applications, and ecosystem of advanced semiconductor packaging, providing readers with a solid overview. The second part focuses on 2.5D packaging processes, delving into crucial aspects, including dielectric materials for RDL and Microvia, RDL fabrication techniques, and material selection for EMC and MUF. Each sub-section within this part presents a detailed analysis of process flows, technology benchmarks, player evaluations, and future trends, providing readers with comprehensive insights.
The report continues beyond the discussion of 2.5D packaging to the third part, which focuses on the innovative Cu-Cu hybrid bonding technology for 3D die stacking. This section provides valuable insights into the manufacturing process and offers guidance on material selection for optimal outcomes. It also showcases case studies highlighting the successful implementation of Cu-Cu hybrid bonding using both organic and inorganic dielectrics. Additionally, the report includes a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, presented in the last chapter. This forecast encompasses unit and area metrics, providing the industry with meaningful perspectives into anticipated market growth and trends for the next decade.
To find out more about this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/MatsforASP.
About IDTechEx
IDTechEx guides your strategic business decisions through its Research, Subscription and Consultancy products, helping you profit from emerging technologies. For more information, contact [email protected] or visit www.IDTechEx.com.
Images download:
https://www.dropbox.com/scl/fo/pq1fth8x0hnomitvgl3e8/h?rlkey=31edolh2sdxdbh1arv2sbf66e&dl=0
Media Contact:
Lucy Rogers
Sales and Marketing Administrator
+44(0)1223 812300
Social Media Links:
Twitter: www.twitter.com/IDTechEx
LinkedIn: www.linkedin.com/company/IDTechEx
Photo – https://mma.prnewswire.com/media/2146745/IDTechEx.jpg
View original content:https://www.prnewswire.co.uk/news-releases/idtechex-explores-materials-and-processing-for-advanced-semiconductor-packaging-301869757.html
Blockchain Press Releases
Bybit Web3 Wallet Integrates Tonstakers: The First of Its TON Staking Offerings to Expand DeFi Opportunities
DUBAI, UAE, Dec. 27, 2024 /PRNewswire/ — Bybit, the world’s second-largest cryptocurrency exchange,is excited to announce the integration of Tonstakers, the leading liquid staking protocol on the TON blockchain, into its Web3 Wallet. This marks the first of Bybit Web3’s TON staking offerings, reinforcing its commitment to expanding decentralized finance (DeFi) opportunities for its users.
With this integration, Bybit Web3 Wallet users can now seamlessly stake Toncoin ($TON) and receive $tsTON (Tonstakers LST) in return. The value of $tsTON increases relative to $TON every 26 hours, ensuring competitive rewards while contributing to the growth and success of the TON ecosystem. The integration also opens the door for 130 million users in the TON ecosystem to access TON staking directly within the Bybit Web3 Wallet.
Bybit is dedicated to simplifying DeFi adoption by providing intuitive and user-friendly staking experiences. This milestone partnership with Tonstakers enables users to unlock annual returns estimated between 3% and 5% APY, with rewards automatically compounded, further cementing Bybit’s role as a leader in DeFi accessibility.
Why Tonstakers Matters: The First of Its Kind
Tonstakers is the inaugural partner in Bybit Web3’s TON staking initiative, setting a new standard for staking services. With a total value locked (TVL) exceeding $260 million and a significant market share in the liquid-staked TON sector, Tonstakers offers Bybit Web3 Wallet users unparalleled access to TON staking benefits:
- Effortless Staking: Securely stake $TON with ease, thanks to the user-friendly interface within the Bybit Web3 Wallet.
- Earn $tsTON Rewards: Receive tokenized staked Toncoin ($tsTON), which can be leveraged within DeFi applications across the TON ecosystem.
- Explore DeFi Liquidity: Engage with Tonstakers Earn to provide liquidity using $tsTON, unlocking diverse earning opportunities.
“Bybit Web3 is proud to deepen our integration with the TON blockchain, a crucial step in our mission to foster a thriving and interconnected Web3 ecosystem,” said Emily Bao, Head of Bybit Web3. “This integration empowers our users with seamless and trusted access to TON liquid staking pools and unlocks valuable earning opportunities. As a strong believer in DeFi adoption, Bybit Web3 is committed to bridging the gap between Web2 and Web3, creating simple, easy, and accessible solutions that bring the benefits of decentralized finance to a wider audience. We believe this integration will significantly contribute to the growth and success of the TON ecosystem.”
Start Staking Today To begin staking your $TON and earning with $tsTON, visit https://www.bybit.com/en/web3/staking and discover the power of Bybit Web3 Wallet’s integration with Tonstakers. Bybit Web3 Wallet currently supports a wide range of staking services beyond TON tokens, including ETH, USDT, USDC, bbSOL, SUI, and more.
#Bybit / #TheCryptoArk / #BybitWeb3
About Bybit Web3
Bybit Web3 is redefining openness in the decentralized world, creating a simpler, open, and equal ecosystem for everyone. We are committed to welcoming builders, creators, and partners in the blockchain space, extending an invitation to both crypto enthusiasts and the curious, with a community of over 130 million wallet addresses across over 30 major ecosystem partners, and counting.
Bybit Web3 provides a comprehensive suite of Web3 products designed to make accessing, swapping, collecting and growing Web3 assets as open and simple as possible. Our wallets, marketplaces and platforms are all backed by the security and expertise that define Bybit as the world’s second-largest cryptocurrency exchange by trading volume, trusted by over 60 million users globally.
Join the revolution now and open the door to your Web3 future with Bybit.
For more details about Bybit Web3, please visit Bybit Web3.
About Bybit
Bybit is the world’s second-largest cryptocurrency exchange by trading volume, serving a global community of over 60 million users. Founded in 2018, Bybit is redefining openness in the decentralized world by creating a simpler, open and equal ecosystem for everyone. With a strong focus on Web3, Bybit partners strategically with leading blockchain protocols to provide robust infrastructure and drive on-chain innovation. Renowned for its secure custody, diverse marketplaces, intuitive user experience, and advanced blockchain tools, Bybit bridges the gap between TradFi and DeFi, empowering builders, creators, and enthusiasts to unlock the full potential of Web3. Discover the future of decentralized finance at Bybit.com.
For more details about Bybit, please visit Bybit Press
For media inquiries, please contact: [email protected]
For updates, please follow: Bybit’s Communities and Social Media
Discord | Facebook | Instagram | LinkedIn | Reddit | Telegram | TikTok | X | Youtube
Photo – https://mma.prnewswire.com/media/2588103/Bybit_Web3_Wallet_Integrates_Tonstakers_The_First_Its_TON_Staking.jpg
Logo – https://mma.prnewswire.com/media/2267288/Logo.jpg
View original content:https://www.prnewswire.co.uk/news-releases/bybit-web3-wallet-integrates-tonstakers-the-first-of-its-ton-staking-offerings-to-expand-defi-opportunities-302339604.html
Blockchain Press Releases
Nodepay Raises $7M Total Funding To Power AI Growth with Real-Time Data Infrastructure
SINGAPORE, Dec. 27, 2024 /PRNewswire/ — Nodepay, a decentralized AI platform transforming unused internet bandwidth into real-time data pipelines for AI training, today announced it has raised a second round of funding, bringing its total to $7 million.
The latest funding round welcomed new strategic investors IDG Capital ($23 Billion AUM), Mythos, Elevate Ventures, IBC, Optic Capital, Funders.VC, Matthew Tan (Etherscan founder) and Yusho Liu (CoinHako Co-founder & CEO) as notable angels. They join an impressive roster of previous backers that includes Animoca Brands, Mirana, OKX Ventures, JUMP Crypto, Tokenbay Capital and more.
Nodepay’s network taps into a global community of users running privacy-protected nodes. By sharing their spare internet bandwidth, these participants earn rewards for creating a real-time data source that improves AI inference with accurate, timely information—an approach known as Retrieval Augmented Generation (RAG).
Darren Nguyen, co-founder of Nodepay commented: “Our mission is to develop solutions that create tangible value for both AI developers and its end users. We give contributors a share in the AI ecosystem they help fundamentally build.”
Nodepay’s infrastructure platform integrates real-time data retrieval, a Web3-focused decentralized answer engine, reinforcement learning for more accurate model output, and gamified human verification. Together, these components combine to create a fair, collaborative, and innovative AI ecosystem.
Eric Le, investment director of IDG Capital, said, “The team at Nodepay is democratizing the AI economy by providing a platform that allows users to share directly in the value they create. We’re proud to support their vision of making AI more accessible and beneficial to all.”
With this funding, Nodepay will continue to commercialize its infrastructure to benefit both its community and partner AI labs. As it prepares to launch on Solana, Nodepay stands ready to lead the next era of decentralized AI development and training.
Already serving over 1.5 million active users worldwide, Nodepay continues to expand its reach, solidifying its role as a leader in the integration of AI and blockchain technology. Users can expect further updates and new announcements through their social channels and official website.
About Nodepay
Nodepay is a decentralized AI platform dedicated to democratizing AI training through real-time data retrieval. By turning idle internet bandwidth into a valuable resource, Nodepay fuels the next generation of AI models and stands at the forefront of AI decentralization.
Photo – https://mma.prnewswire.com/media/2587832/7M_Raised_Funds.jpg
Logo – https://mma.prnewswire.com/media/2587833/1080x1080_Black___Nodepay_2_Logo.jpg
View original content:https://www.prnewswire.co.uk/news-releases/nodepay-raises-7m-total-funding-to-power-ai-growth-with-real-time-data-infrastructure-302339478.html
Blockchain Press Releases
Markets Show Resilience Ahead of End-of-Year Options Expirations: Bybit x Block Scholes Crypto Derivatives Report
DUBAI, UAE, Dec. 26, 2024 /PRNewswire/ — Bybit, the world’s second-largest cryptocurrency exchange by trading volume, released the latest Crypto Derivatives Analytics Report in collaboration with Block Scholes, highlighting the muted market volatility despite major options expirations on Friday. BTC and ETH’s realized volatility has increased, but short-term options haven’t adjusted to this change. This indicates that while spot prices are fluctuating, the options market is not fully reacting to these shifts, although BTC and ETH volumes have displayed slightly different patterns.
With more than $525 million in BTC and ETH options contracts expiring on Dec 27, 2024’s end-of-year options expiration looks set to be one of the biggest yet, yet expectations for volatility have remained subdued. The report highlights an unusual inversion in ETH’s volatility structure, but BTC has not mirrored the reaction. Additionally, a change in funding rates—sometimes turning negative as spot prices drop—signals a new market phase. Notably, BTC’s volatility structure has been less responsive to changes in spot prices, whereas ETH’s short-term options are exhibiting more noticeable fluctuations.
Key Findings:
BTC Options Expirations:
In the past month, BTC’s realized volatility has been higher than implied volatility on three occasions, each time reaching a relatively calm equilibrium. Open interest in BTC options remains high, contributing to potential increased volatility as we near the end of the year. Around $360 million worth of BTC options (both puts and calls) are set to expire soon, which can affect price movement.
ETH Options: Calls Dominate
Despite a mid-week inversion, ETH’s volatility term structure has flattened, maintaining levels similar to those seen over the past month. In the final week of 2024, calls overwhelmed puts in open interest in ETH options, although market movements and trading activities are more on the put side.
Access the Full Report:
Gain deeper insights and explore the potential impacts on your crypto trading strategies by downloading the full report here: Bybit X Block Scholes Crypto Derivatives Analytics Report (Dec 24, 2024)
#Bybit / #BybitResearch
About Bybit
Bybit is the world’s second-largest cryptocurrency exchange by trading volume, serving a global community of over 60 million users. Founded in 2018, Bybit is redefining openness in the decentralized world by creating a simpler, open and equal ecosystem for everyone. With a strong focus on Web3, Bybit partners strategically with leading blockchain protocols to provide robust infrastructure and drive on-chain innovation. Renowned for its secure custody, diverse marketplaces, intuitive user experience, and advanced blockchain tools, Bybit bridges the gap between TradFi and DeFi, empowering builders, creators, and enthusiasts to unlock the full potential of Web3. Discover the future of decentralized finance at Bybit.com.
For media inquiries, please contact: [email protected]
For more information, please visit: https://www.bybit.com
For updates, please follow: Bybit’s Communities and Social Media
Discord | Facebook | Instagram | LinkedIn | Reddit | Telegram | TikTok | X | Youtube
Photo – https://mma.prnewswire.com/media/2587821/Sources_Bybit_Block_Scholes.jpg
Logo – https://mma.prnewswire.com/media/2267288/Logo.jpg
View original content:https://www.prnewswire.co.uk/news-releases/markets-show-resilience-ahead-of-end-of-year-options-expirations-bybit-x-block-scholes-crypto-derivatives-report-302339299.html
-
Blockchain3 days agoUNICC and ShelterZoom Developed a Secure Document Tracking and E-Signature Solution for the UN System
-
Blockchain Press Releases3 days agoBybit Champions Web3 Innovation and Strengthens Ties with Asia’s Crypto Community at Taipei Blockchain Week
-
Blockchain7 days agoLCT Secures VARA In-Principle Approval, Defining Its Role in Dubai’s Crypto Landscape
-
Blockchain4 days agoBitget Partners with Fiat24 to Advance PayFi Solutions for Crypto
-
Blockchain4 days agoMainframe Market Valuation is Skyrocketing to Reach US$ 7,241.13 Million by 2033 | Astute Analytica
-
Blockchain4 days agoLibfx.com Announces Vision to Build a World-Class Financial Platform
-
Blockchain3 days agoBybit Supports Wildlife Conservation Through Sea Turtle Adoption Initiative with Subsum
-
Blockchain Press Releases1 day agoMarkets Show Resilience Ahead of End-of-Year Options Expirations: Bybit x Block Scholes Crypto Derivatives Report
