Blockchain Press Releases
IDTechEx Explores Materials and Processing for Advanced Semiconductor Packaging
BOSTON, July 5, 2023 /PRNewswire/ —
Why Is Advanced Semiconductor Packaging Needed?
This is a data-centric world. The growing amount of data generated in various industries increasingly drives the demand for high-bandwidth computing. Applications such as machine learning and AI require powerful processing capabilities, leading to the need for dense transistor placement on chips and compact interconnection bump pitches in packaging. The latter highlights the significance of semiconductor technologies in meeting these requirements.
Semiconductor packaging has evolved from board-level to wafer-level integration, bringing notable advancements. Wafer level integration provides advantages over traditional methods, such as increased connection density, smaller footprints for size-sensitive applications, and enhanced performance.
“Advanced” semiconductor packaging specifically includes high-density fan-out, 2.5D, and 3D packaging, characterized by a bumping pitch size below 100 µm, enabling at least 10x higher interconnect densities.
Bandwidth Is Key
To enhance bandwidth from a packaging perspective, two key factors come into play: the total number of I/Os (input/output) and the bit rate per each I/O. Increasing the total number of I/Os requires enabling finer line/space (L/S) patterns in each routing layer/redistribution layer (RDL) and having a higher number of routing layers. On the other hand, improving the bit rate per I/O is influenced by the interconnect distance between chiplets and the selection of dielectric materials. These factors directly impact the overall performance and efficiency of the packaging system.
Unleashing High Bandwidth: Exploring Materials and Processing for Advanced Semiconductor Packaging
Delving deeper into achieving higher wiring density and a higher bit rate per I/O from a materials and processing perspective reveals the critical role played by the selection of dielectric materials and the utilization of appropriate processing techniques. These factors have a significant impact on the overall performance and capabilities of the packaging system.
Selecting suitable dielectric materials is crucial, considering properties like low dielectric constant, optimal CTE (as close to the CTE of Cu as possible), and favorable mechanical characteristics that ensure module reliability, such as Young’s modulus and elongation. These choices enable higher data rates while preserving signal integrity and facilitating fine line/space features for increased wiring density.
In high-performance accelerators, such as GPUs, inorganic dielectrics like SiO2 have been extensively utilized to achieve ultra-fine line/space (L/S) features. Nevertheless, their use is limited in applications that demand high-speed connectivity due to their high RC delays. As an alternative, organic dielectrics have been proposed for their cost-effectiveness and ability to mitigate RC delays through their low dielectric constant. However, organic dielectrics present challenges, including high CTE, which can negatively impact the device’s reliability, and difficulties in scaling to fine L/S features.
In addition to selecting appropriate materials, the processing techniques employed during packaging fabrication play a crucial role in achieving a higher number of I/Os and improving the bit rate per I/O. The steps involved in 2.5D packaging processes, including lithography, CMP (Chemical Mechanical Planarization), etching processes, and the CMP and bonding processes in 3D Cu-Cu hybrid bonding, present challenges in achieving tighter routing and increased wiring density. IDTechEx provides detailed insights into how the choice of materials influences the fabrication processes, offering a comprehensive understanding of their impact on advanced semiconductor packaging.
Materials and Technologies Covered in the IDTechEx Report
IDTechEx’s “Materials and Processing for Advanced Semiconductor Packaging 2024-2034” report is divided into four main parts, offering a structured approach to understanding advanced semiconductor packaging. The first part provides a comprehensive introduction to the technologies, development trends, key applications, and ecosystem of advanced semiconductor packaging, providing readers with a solid overview. The second part focuses on 2.5D packaging processes, delving into crucial aspects, including dielectric materials for RDL and Microvia, RDL fabrication techniques, and material selection for EMC and MUF. Each sub-section within this part presents a detailed analysis of process flows, technology benchmarks, player evaluations, and future trends, providing readers with comprehensive insights.
The report continues beyond the discussion of 2.5D packaging to the third part, which focuses on the innovative Cu-Cu hybrid bonding technology for 3D die stacking. This section provides valuable insights into the manufacturing process and offers guidance on material selection for optimal outcomes. It also showcases case studies highlighting the successful implementation of Cu-Cu hybrid bonding using both organic and inorganic dielectrics. Additionally, the report includes a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, presented in the last chapter. This forecast encompasses unit and area metrics, providing the industry with meaningful perspectives into anticipated market growth and trends for the next decade.
To find out more about this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/MatsforASP.
About IDTechEx
IDTechEx guides your strategic business decisions through its Research, Subscription and Consultancy products, helping you profit from emerging technologies. For more information, contact [email protected] or visit www.IDTechEx.com.
Images download:
https://www.dropbox.com/scl/fo/pq1fth8x0hnomitvgl3e8/h?rlkey=31edolh2sdxdbh1arv2sbf66e&dl=0
Media Contact:
Lucy Rogers
Sales and Marketing Administrator
+44(0)1223 812300
Social Media Links:
Twitter: www.twitter.com/IDTechEx
LinkedIn: www.linkedin.com/company/IDTechEx
Photo – https://mma.prnewswire.com/media/2146745/IDTechEx.jpg
View original content:https://www.prnewswire.co.uk/news-releases/idtechex-explores-materials-and-processing-for-advanced-semiconductor-packaging-301869757.html
Following a management buy-out by the management team at TOKO FZE, the business has been rebranded as Scintilla, the revolutionary platform providing on-chain solutions and services to make investments more inclusive, accessible, and efficient. Having been developed within DLA Piper’s Law& innovation portfolio, TOKO – now Scintilla has a fresh brand identity, new leadership, and innovative product offerings. Scintilla is set to reshape the future of finance by enabling businesses to unlock the power of blockchain technology across various asset classes, with DLA Piper remaining as a minority shareholder.
Regulated by Dubai’s Virtual Assets Regulatory Authority (VARA), Scintilla is one of the first digital asset companies to gain full market licenses, marking a significant milestone in the sector’s landscape. Being a regulated entity underscores Scintilla’s commitment to the highest standards of compliance and security while pioneering new solutions for tokenization in the global market.
Innovating Finance Through Tokenization
Scintilla offers a comprehensive suite of tokenization services designed to bring liquidity, transparency, and efficiency to traditional finance sectors. From tokenized financial products, and real estate all the way to new legal funding products, Scintilla’s digital asset solutions enable clients to tokenize assets that were previously inaccessible to investors or illiquid.
Scintilla’s services include:
Advisory Services: The gateway to successful market entry. From initial opportunity assessment to strategic development of game-changing tokenization-based solutions.
Use Case Development: Bringing products to life. From initial POC development and iteration towards MVP all the way through to the full market launch.
Broker/Dealer Services: Creating new markets. Regulated primary market trading, ensuring the highest levels of trust and security within the tokenization space.
Exchange Services: Universal participation. Seamless, secure secondary trading of tokenized assets, with industry-leading technology and compliance standards.
Scintilla is uniquely positioned to capitalize on the confluence of Dubai’s world-leading regulatory environment, cutting-edge technology, and the burgeoning RWA market.
A New Era for Scintilla
The relaunch of Scintilla represents more than just a rebranding—it signifies the company’s growing ambition to lead in the digital asset space. With an expanded team of industry experts, including continuing Board representation from DLA Piper, and a clear strategic vision, Scintilla is set to drive the adoption of tokenization in traditional financial markets.
“Our relaunch marks the beginning of an exciting new chapter for Scintilla and the wider industry. We are committed to pushing the boundaries of what is possible in digital finance while ensuring our solutions are underpinned by strong regulatory compliance,” said Tim Popplewell, CEO of Scintilla. “With our new suite of products and services, we are empowering investors to transform the way they manage and access value.”
Jean-Pierre Douglas-Henry, Managing Director, Sustainability and Resilience, DLA Piper added: “Innovation is a key strand in our business strategy. As our business focuses on developing and nurturing innovations that add significant value to our clients through our Law& innovation program, it is fantastic to see this solution spun out into the thriving digital asset space for the next stage of its growth and development.”
The post DLA Piper’s crypto tokenization engine TOKO relaunches as Scintilla appeared first on HIPTHER Alerts.
Blockchain Press Releases
KuCoin Managing Director Alicia Kao Highlights Crypto Education at Blockchain Life 2024
DUBAI, UAE, Oct. 24, 2024 /PRNewswire/ — KuCoin, a global leader in the cryptocurrency market, proudly participated in Blockchain Life 2024, one of the industry’s premier events, held in Dubai as Stage Sponsor and Gold Sponsor. This event brought together a diverse group of enthusiasts, professionals, investors, and traders to delve into the ever-evolving world of blockchain and cryptocurrency.
During her keynote speech on “Shaping Crypto Minds with KuCoin: Education Makes Mastery,” Alicia, Managing Director of KuCoin, highlighted the knowledge gaps currently facing the industry. KuCoin is actively addressing these through its various educational initiatives. In the first half of 2024 alone, KuCoin Learn attracted 1.5 million engaged users, while its Learn and Earn program saw participation from over 2.72 million users since its inception. These programs are part of KuCoin’s broader effort to elevate user education and ensure traders and investors have the tools they need for informed participation in the crypto space.
Alicia emphasized the importance of security in her presentation, reiterating KuCoin’s commitment to prioritizing user needs and safeguarding their interests. “At KuCoin, we believe that an educated user is a secure user. Our educational platforms, including KuCoin Learn and KuCoin Campus, are designed to empower our users with knowledge that enhances their trading experiences while emphasizing the critical importance of security,” she stated.
In addition to her keynote, Alicia participated in a panel discussion titled “Crypto Exchanges and Private Investors: Shaping Investment Strategies and Adapting to Market Trends.” The panel explored effective strategies for navigating the crypto industry, focusing on how centralized exchanges (CEXs) can help foster industry growth by aligning with investor needs in changing market conditions.
KuCoin’s presence at Blockchain Life 2024 underscores its ongoing commitment to leadership through education in the cryptocurrency sector. It prepares its users to participate in and excel in the evolving digital economy.
About KuCoin
Launched in September 2017, KuCoin is a leading cryptocurrency exchange with its operational headquarters in Seychelles. As a user-oriented platform with a focus on inclusiveness and community engagement. It offers over 800 digital assets across Spot trading, Margin trading, P2P Fiat trading, Futures trading, and Staking to its 36 million users in more than 200 countries and regions. KuCoin ranks as one of the top 6 crypto exchanges. KuCoin was acclaimed as “One of the Best Crypto Apps & Exchanges of June 2024” by Forbes Advisor and has been included as one of the top 50 companies in the “2024 Hurun Global Unicorn List”. Learn more at https://www.kucoin.com/.
Photo – https://mma.prnewswire.com/media/2538870/image_5002362_27118193.jpg
Logo – https://mma.prnewswire.com/media/2356857/KuCoin_Horizontal_Green_LOGO_Logo.jpg
View original content:https://www.prnewswire.co.uk/news-releases/kucoin-managing-director-alicia-kao-highlights-crypto-education-at-blockchain-life-2024-302285855.html
Blockchain Press Releases
Bybit’s WSOT Copy Trading Fest Offers 100,000 USDT Prize Pool for Crypto Investors
DUBAI, UAE, Oct. 24, 2024 /PRNewswire/ — Bybit, the world’s second-largest cryptocurrency exchange by trading volume, announces the WSOT Copy Trading Fest, inviting crypto traders and investors to compete for their share of an exciting 100,000 USDT prize pool. Running until October 31, 2024, the event offers participants the opportunity to showcase their expertise or leverage the strategies of top traders.
The World Series of Trading (WSOT) 2024 marks the fifth edition of Bybit’s premier crypto trading event, renowned for bringing global traders together. This year’s WSOT features a total prize pool of up to 10,000,000 USDT, with the Copy Trading Fest adding a unique competitive element for both seasoned and beginner traders.
Tailored for All Traders
- Experienced Traders:
- Compete as Master Trader by executing winning strategies and aiming for the 100,000 USDT prize pool. The top 50 Master Traders with the highest PnL will split the 50,000 USDT pool.
- New and Aspiring Investors:
- Join as Follower, copying the strategies of Master Traders to maximize returns without needing advanced technical skills. The top 100 Followers by PnL will split an additional 50,000 USDT pool.
How to Join and Compete
- Choose Your Role: Decide whether you’ll lead as a Master Trader or copy trades as a Follower.
- Meet the Eligibility Criteria: Ensure a minimum $50,000 trading volume during the event to qualify for rewards.
- Accumulate PnL: Both realized and unrealized profits count towards your leaderboard ranking.
- Fast Rewards: All prizes will be credited to the Bybit Rewards Hub within 10 days after the event ends.
Seize the Opportunity Today!
Whether you’re aiming to showcase your expertise or earn passively by following seasoned traders, the WSOT Copy Trading Fest offers a competitive, transparent, and rewarding experience. With the trading community buzzing, now is the time to jump in and claim your share of the 100,000 USDT prize pool.
#Bybit / #TheCryptoArk / #WSOT2024
About Bybit
Bybit is the world’s second-largest cryptocurrency exchange by trading volume, serving over 50 million users. Established in 2018, Bybit provides a professional platform where crypto investors and traders can find an ultra-fast matching engine, 24/7 customer service, and multilingual community support. Bybit is a proud partner of Formula One’s reigning Constructors’ and Drivers’ champions: the Oracle Red Bull Racing team.
For more details about Bybit, please visit Bybit Press
For media inquiries, please contact: [email protected]
For more information, please visit: https://www.bybit.com
For updates, please follow: Bybit’s Communities and Social Media
Discord | Facebook | Instagram | LinkedIn | Reddit | Telegram | TikTok | X | Youtube
Photo – https://mma.prnewswire.com/media/2539299/Bybit_s_WSOT_Copy_Trading_Fest_Offers_100_000_USDT_Prize.jpg
Logo – https://mma.prnewswire.com/media/2267288/Logo.jpg
View original content:https://www.prnewswire.co.uk/news-releases/bybits-wsot-copy-trading-fest-offers-100-000-usdt-prize-pool-for-crypto-investors-302285587.html
-
Blockchain Press Releases7 days agoGrexie Signchain Launches on November 1st, 2024: Enabling Smart Contract Developers to Bring Off-Chain Data On-Chain with Seamless Gas-Paid Signing
-
Blockchain Press Releases6 days agoRace to the Top: Bybit Adds $1 Million to WSOT 2024 Prize Pool – Final Days to Register!
-
Blockchain Press Releases6 days ago
Ostium Launches Novel Macro Trading Platform Amidst Growth in Global Events-Based Trading
-
Blockchain Press Releases2 days agoBitMEX achieves industry-leading low on-chain AML risk profile through strategic partnership with Chainalysis
-
Blockchain6 days agoIndia Fintech Blockchain Report 2024: Market to Grow by Over $1.5 Billion by 2030 – Regional Insights, Competition, Forecast and Opportunities
-
Blockchain2 days ago
India Digital Payment Gateway Research Report 2024: $32.96 Bn Market Trends Analysis, Regional Insights, Competitive Landscape, Forecasts and Opportunities 2020-2030
-
Blockchain Press Releases2 days ago
Acceleration of global marketing collaboration between Milk Partners, AirAsia rewards, and The Sandbox
-
Blockchain7 days agoLocus Chain, Creta Platform’s strategy and vision were introduced upon invitation from Lloyd Capital and Mike Pompeo in New York City
